JPS63176576U - - Google Patents

Info

Publication number
JPS63176576U
JPS63176576U JP6804187U JP6804187U JPS63176576U JP S63176576 U JPS63176576 U JP S63176576U JP 6804187 U JP6804187 U JP 6804187U JP 6804187 U JP6804187 U JP 6804187U JP S63176576 U JPS63176576 U JP S63176576U
Authority
JP
Japan
Prior art keywords
high viscosity
groove
extrudes
viscosity substance
extrusion piston
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6804187U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525736Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987068041U priority Critical patent/JPH0525736Y2/ja
Publication of JPS63176576U publication Critical patent/JPS63176576U/ja
Application granted granted Critical
Publication of JPH0525736Y2 publication Critical patent/JPH0525736Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP1987068041U 1987-05-07 1987-05-07 Expired - Lifetime JPH0525736Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987068041U JPH0525736Y2 (en]) 1987-05-07 1987-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987068041U JPH0525736Y2 (en]) 1987-05-07 1987-05-07

Publications (2)

Publication Number Publication Date
JPS63176576U true JPS63176576U (en]) 1988-11-16
JPH0525736Y2 JPH0525736Y2 (en]) 1993-06-29

Family

ID=30907497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987068041U Expired - Lifetime JPH0525736Y2 (en]) 1987-05-07 1987-05-07

Country Status (1)

Country Link
JP (1) JPH0525736Y2 (en])

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007253086A (ja) * 2006-03-24 2007-10-04 Kenwood Corp 温度調整式シリンジ
JP2009539607A (ja) * 2006-06-13 2009-11-19 ノードソン コーポレーション 液体吐出シリンジ
JP2017077556A (ja) * 2016-08-18 2017-04-27 加賀ワークス株式会社 粘性材料ディスペンサ用カートリッジ
JP2018047472A (ja) * 2018-01-10 2018-03-29 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ
US10293361B2 (en) 2015-10-19 2019-05-21 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
JP2019171385A (ja) * 2019-07-06 2019-10-10 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ
US10479587B2 (en) 2014-08-25 2019-11-19 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165596U (ja) * 1982-04-28 1983-11-04 品川白煉瓦株式会社 亀裂補修装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165596U (ja) * 1982-04-28 1983-11-04 品川白煉瓦株式会社 亀裂補修装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007253086A (ja) * 2006-03-24 2007-10-04 Kenwood Corp 温度調整式シリンジ
JP2009539607A (ja) * 2006-06-13 2009-11-19 ノードソン コーポレーション 液体吐出シリンジ
US10479587B2 (en) 2014-08-25 2019-11-19 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10293361B2 (en) 2015-10-19 2019-05-21 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10507487B2 (en) 2015-10-19 2019-12-17 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
JP2017077556A (ja) * 2016-08-18 2017-04-27 加賀ワークス株式会社 粘性材料ディスペンサ用カートリッジ
JP2018047472A (ja) * 2018-01-10 2018-03-29 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ
JP2019171385A (ja) * 2019-07-06 2019-10-10 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ

Also Published As

Publication number Publication date
JPH0525736Y2 (en]) 1993-06-29

Similar Documents

Publication Publication Date Title
JPS63176576U (en])
JPS6395514U (en])
JPS58122511U (ja) 化粧用塗布液容器
JPH02106121U (en])
JPS58136014U (ja) 化粧料容器
JPS6346036Y2 (en])
JPS6375399U (en])
JPH0273158U (en])
JPS58125514U (ja) 化粧用塗布液容器
JPH0251821U (en])
JPH0336649U (en])
JPS61177523U (en])
JPS60112446U (ja) 液体容器に於ける定量取出構造
JPH01153049U (en])
JPH01158482U (en])
JPH0366864U (en])
JPS5940023U (ja) 口紅等のカ−トリツヂ容器
JPH0283254U (en])
JPS63105669U (en])
JPS6227731U (en])
JPH0251560U (en])
JPH0275010U (en])
JPS61186575U (en])
JPH01122885U (en])
JPH01170245U (en])